? semiconductor components industries, llc, 2010 june, 2010 -- rev. 0 1 publication order number: nom03a6--ay17g/d nom03a6--ay17g 300dpi high--speed contact image sensor module description the nom03a6--ay17g contact image sensor (cis) module integrates a yellow led light source with reflector, lens and image sensor in a compact housing. the module is designed for document scanning, mark reading, gaming and office automation equipment applications and is suitable for scanning documents up to 104 mm wide. an analog video output achieves a scanning rate of 250 m sec/line. the nom03a6--ay17g module employs proprietary cmos image sensing technology from on semiconductor to achieve high--speed performance and high sensitivity. features ? light source, lens and sensor are integrated into a single module ? 104 mm scanning width at 11.8 dots per mm resolution ? 250 m sec/line scanning speed @ 5.0 mhz pixel rate ? analog video output ? supports a6 paper size at up to 138 pages per minute ? yellow led light source with reflector ? wide dynamic range ? compact 119.7 mm x 19.0 mm x 13.7 mm module housing ? low power ? light weight 1.1 oz packaging ? these devices are pb--free, halogen free/bfr free and are rohs compliant applications ? ticket, check and card scanners ? receipt scanners ? mark readers ? office automation equipment motor contact image sensor module paper insertion sensing switch motor controller and driver scan system timing and control analog to digital converters parallel port transceiver led drivers dsp figure 1. typical scanner application http://onsemi.com image sensor module a6 case modaf marking diagram yy = year mm = month ssssss = serial number g = pb--free package connector pin assignment see detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. ordering information vled gled vss cp gnd sp vdd gnd vout 123 10 45 9 8 67 nom03a6--ay17g yymmssssss gnd
nom03a6--ay17g http://onsemi.com 2 table 1. ordering information part number package shipping configuration nom03a6--ay17g (pb--free) 100 per packing carton 1 2 3 4 1248 shift register photo sensor array rod lens buf buf vled gled vdd (+5 v) gnd sp cp yellow led light bar pixel 1 corresponds to connector end of the module amp vout 1 2 3 4 figure 2. simplified block diagram vss (--5 v) table 2. pin function description pin pin name description 1 vout analog video output 2 gnd ground 3 vdd +5 v power supply 4 vss --5 v to --12 v power supply 5 gnd ground 6 sp shift register start pulse 7 gnd ground 8 cp sampling clock pulse 9 gled ground for the led light source 10 vled power supply for the led light source
nom03a6--ay17g http://onsemi.com 3 table 3. absolute maximum ratings parameter symbol value unit power supply voltage v dd 7 v v ss -- 1 5 v v led 6 v power supply current i led 450 ma input voltage range for sp, cp v in --0.5tov dd +0.5 v storage temperature t stg --20 to 75 c storage humidity, non--condensing h stg 10 to 90 % esd capability, contact discharge (note 1) esd hbm 2 kv stresses exceeding maximum ratings may dam age the device. maximum ratings are stres s ratings only. functional operation above the recommended operating conditions is not impli ed. extended exposure to stresses above the re commended operating conditions may affect device reliability. 1. this module assembly has been esd tested to iec61000--4--2 (hbm) contact discharge table 4. recommended operating ranges (unless otherwise specifi ed, these specifications apply t a =25 c) (note 2) parameter symbol min typ max unit power supply voltage (note 3) v dd 4.5 5 5.5 v v ss -- 1 2 -- 5 -- 4 . 5 v v led 4.5 5 5.5 v power supply current i dd 20 30 40 ma i ss 5 6 7 ma i led 250 300 350 ma low level input voltage for sp, cp v il 0 0 0.8 v high level input voltage for sp, cp v ih 4.5 5.0 v dd +0.3 v line scanning rate (note 4) t int 227 250 624 m s clock frequency (note 5) f 2.0 5.0 5.5 mhz clock period t o 182 200 500 ns clock pulse width (note 6) t w 46 50 125 ns clock pulse high duty cycle dc cp 20 25 60 % start pulse width (note 6) t wsp 150 180 480 ns start pulse setup time t su 20 ns start pulse hold time t h 20 ns prohibit crossing time (note 7) t prh 20 ns clock to video output propagation delay rising t pcor 115 ns clock to video output propagation delay falling t pcof 20 ns operating temperature t op 0 50 c operating humidity, non--condensing h op 10 60 % 2. refer to figure 3 for more information on ac characteristics 3. v led directly affects illumination intensity, which directly affects v out . 4. t int is the line scanning rate or integration time. t int is determined by the interval between two s tart pulses. the clock is proportional to t int . 5. main clock frequency (f) corresponds to the video sampling frequency. 6. min, typ, max specifications reflect operatio n at the corresponding min, typ, max clock frequency. 7. prohibit crossing time is to insure that two s tart pulses are not supplied in the same scan line time. sp may only be active high during one falling edge of cp for any given scan.
nom03a6--ay17g http://onsemi.com 4 table 5. physical specifications parameter symbol typ unit scan width pd w 104 mm number of photo detector arrays pda n 13 arrays number of photo detectors pd n 1248 elements table 6. physical characteristics parameter symbol min typ max unit pixel pitch pd sp 84.7 m m inter--array spacing pda sp 150 180 210 m m inter--array vertical alignment pda vxp -- 4 0 0 40 m m yellow led peak wavelength p 566 575 581 nm table 7. electro--optical characteristics test conditions parameter symbol value unit power supply voltage v dd 5.0 v v led 5.0 v clock frequency f 5.0 mhz clock pulse high duty cycle dc cp 25 % line scanning rate t int 250 m s led arrays pulsed time on (note 8) led_ton 26 ms led arrays pulsed time off (note 8) led_toff 356 ms operating temperature t op 25 c 8. production tested with pulsing leds.
nom03a6--ay17g http://onsemi.com 5 table 8. electro--optical characteristics (unless otherwise specified, these s pecifications were achieved with the test conditions defined in table 7) parameter symbol min typ max unit bright analog output voltage (note 9) v pavg 0.9 1.0 1.1 v bright output non--uniformity (note 10) u p -- 3 0 30 % bright output non--uniformity total (note 11) u ptotal 60 % adjacent pixel non--uniformity (note 12) u padj 25 % dark output voltage (note 13) v d 200 mv dark non--uniformity (note 14) u d 75 mv modulation transfer function at 75 line pairs per in (lp/in) (note 15) mtf 75 30 % modulation transfer function at 150 line pairs per in (lp/in) (notes 15, 16) mtf 150 15 % 9. v pavg = v p(n) /1248, where v p is the pixel amplitude value of v out for a bright signal defined as a whi te document with leds turned on, n is the sequential pixel number in one scan line. 10. u p =[(v pmax ?v pavg )/v pavg ] x 100%, or [v pavg ?v pmin )/v pavg ] x 100%, whichever is greater, where v pmax is the maximum pixel voltage of any pixel at full bright v pmin is the minimum pixel voltage of any pixel at full bright 11. u ptotal =[(v pmax ?v pmin )/v pavg ] x 100%, 12. u padj =max[|(v p(n) ?v p(n+1) |/v p(n) ] x 100%, where u padj is the nonuniformity in percent between adjacent pixels for a bright background 13. v d is the pixel amplitude value of v out for a dark signal defined as a black document with leds turned off 14. u d =v dmax ?v dmin , where v dmax is the maximum pixel voltage of any dark pixel with the leds turned off v dmin is the minimum pixel voltage of any dark pixel with the leds turned off 15. mtf = [(v max ?v min )/(v max +v min )] x 100%, where v max is the maximum output voltage at the specified line pairs per inch (lp/in) v min is the minimum output voltage at the specified lp/in 16. for information only. figure 3. timing diagram cp sp vout pixel 1 pixel 2 pixel 3 pixel 4 gnd t wsp t su t prh t h t prh t w t pcof v d v p t o t pcor
nom03a6--ay17g http://onsemi.com 6 description of operation functional description the nom03a6--ay17g module consists of 13 contact image sensors, each with 96 pixel elements, that are cascaded to provide 1248 photo--detectors with their associated multiplex switches and double--buffered digital shift register that controls its sequential readout. a buffer amplifies the video pixels from the image sensors and output the analog video signal of the module as shown in figure 2. in operation, the sensors produce an analog image pixel signal (or video signal) proportional to the exposure on the corresponding picture elements on the document. the vout signal outputs 1248 pixels for each scan line. the first bit shifted out from vout during each scan represents the first pixel on the connector end of the module. a pictorial of the nom03a6--ay17g cross section view is shown in figure 4. mounted in the module is a one--to--one graded--index micro lens array that focuses the scanned document image onto the sensing plane. illumination is accomplished by means of an integrated led light source. an internal reflector helps illuminate the document more completely, eliminating shadows caused by wrinkles in the paper. all components are housed in a small plastic housing, which has a glass cover. the top surface of the glass acts as the focal point for the object being scanned and protects the imaging array, micro lens assembly and led light source from dust. pcb sensors rod lens led bar module housing document surface glass window light path figure 4. module cross section view connector pin out description connections to the module are via a 2.4x14.50mm 10--pin connector (ece part number ebw--pk23--p010l2--3z) located at one end of the module as shown in the package drawing on page 8. the location of pin number 1 is indicated on the package drawing. scanner applications a typical use of the nom03a6--ay17g module in scanner applications is shown in figure 6. the document to be digitized is fed into the scanner where a sensor detects its presence. the scanner then operates the motor to move the paper under the contact image sensor module. the module illuminates the paper with internal leds and the image sensor pixel array detects the amount of reflected light and simultaneously measures a full line of pixels which are sampled and transferred to a fifo for storage and conversion to a parallel output format. once the pixel line is processed, the motor advances the paper and the next scan line is captured. initialization document detected? start scan sp= , cp= ctr=0 transfer scan line data done ctr++ == 1248 no no yes document detected? cp= initialization document detected? start scan sp= , cp= ctr=0 read pixel into memory transfer scan line data done no no yes document detected? cp= figure 5. typical scanner algorithm figure 5 outlines the basic steps in the scanner control sequence. first the circuits are initialized and the scanner waits for a document to be detected, usually by a paper sensing switch. then a start pulse and clock pulse are supplied to capture a line image. at the next clock pulse the first pixel value appears on the output. the pixel can be stored in a local line buffer memory. subsequent clocks cause the remaining pixels to be shifted out and stored in the line buffer. once the complete line has been shifted out it can be transferred to the host application and the system advances the paper and the line scan process repeats until the paper sensing switch indicates the document has passed completely through the scanner. device marking and barcode description each module is marked with a tag that contains the part number, a number combining the manufacturing date code and serial number and a barcode. the barcode presents the date code and serial number in interleave 2 of 5 barcode format as follows yymmssssss where yy is the year, mm is the month, and ssssss is the serial number. glass lens care precautions should be taken to avoid scratching or touching the glass lens. the glass lens may be cleaned with alcohol.
nom03a6--ay17g http://onsemi.com 7 figure 6. typical scanner assembly
nom03a6--ay17g http://onsemi.com 8 package dimensions image sensor module a 6 case modaf issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. leading edge of the approach angle on the glass is lower than the top of the housing. 4. bore depth is 6.0 with a 0.2 lead--in chamfer. 5. pin header, model number ebw--pk23--p010l2--3z, 1x10 pin, pitch 1.25. 6. glass is glued on all 4 sides. 7. glass thickness is 1.85. 8. use m2.3 self tapping screws for mounting. torque screws between 1.80 kgf--cm and 2.00 kgf--cm. 9. dimension d1 denotes the scan length. 10. dimension k denotes the position of the first pixel. dim a min max 13.00 14.00 millimeters a1 6.70 7.70 b 17.70 18.30 b1 18.70 19.30 d1 104.00 ref e 2.10 2.30 h 34.80 35.80 j 5.70 6.30 k 6.00 8.00 l b2 5.50 6.50 c 15.20 15.80 d 119.20 120.20 6.00 ref a2 13.20 14.20
nom03a6--ay17g http://onsemi.com 9 packing dimensions no. name material 1 shockproof pad epe 2 packing tray polyfoam 3 conduct electricity sheet pe + conductive sheet 4 waterproof bag pe 5 packing box--carton kraft paper on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further noti ce to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation speci al, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performa nce may vary over time. all operating parameters, including ?typicals? must be validated for each custo mer application by customer?s technical experts. scillc does not conve y any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant int o the body, or other applications intended to support or sustain life, or for any other application in which the f ailure of the scillc product could create a situation where personal inj ury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthoriz ed application, buyer shall indemnify and hold scillc and its officers, em ployees, subsidiaries, affiliates, and distributors harmless against all claims, cos ts, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, an y claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the p art. scillc is an equal opportunity/affirmative action employer. this literature is subj ect to all applicable copyright la ws and is not for resale in any manner. publication ordering information n. american technical support : 800--282--9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81--3--5773--3850 nom03a6--ay17g/d the products described herein (nom03a6--ay17g), is covered by one or mo re of the following u.s. patent; 6,025, 935. there may be other patents pending . literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303--675--2175 or 800--344--3860 toll free usa/canada fax : 303--675--2176 or 800--344--3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loca l sales representative
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